Junction Temperature Limits in Semiconductor Design
Die temperature is the dominant accelerant for most semiconductor wear-out mechanisms, and setting a junction-temperature policy is the single highest-leverage reliability decision in an electronic design. The Navy set a 110 degrees C ceiling under Willoughby after finding fleet equipment running at 140-150 degrees C, a difference he documented as roughly two orders of magnitude in reliability.
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Die temperature is the dominant accelerant for most semiconductor wear-out mechanisms, and setting a junction-temperature policy is the single highest-leverage reliability decision in an electronic design. The Navy set a 110 degrees C ceiling under Willoughby after finding fleet equipment running at 140-150 degrees C, a difference he documented as roughly two orders of magnitude in reliability.
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