Solder Joint Fatigue in Surface-Mount Assemblies
Mismatched thermal expansion between package and board strains the solder joint every cycle, and crack propagation through that joint is the dominant wear-out mechanism of modern assemblies. It is the concrete case that makes Coffin-Manson, thermal cycling screens and workmanship control all point at the same physical object.
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Mismatched thermal expansion between package and board strains the solder joint every cycle, and crack propagation through that joint is the dominant wear-out mechanism of modern assemblies. It is the concrete case that makes Coffin-Manson, thermal cycling screens and workmanship control all point at the same physical object.
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