Altium Academy
12 minutes
Thermal Design and Component Placement for Cooling
Where heat is generated and how it is routed out is set by placement, copper and airflow, and it decides the junction temperatures the rest of the reliability case depends on. Willoughby's ASP signal processor went from roughly 200 to 750 hours MTBF from a board relayout alone, with no circuit change — the clearest demonstration that placement is a reliability decision.