About Design Electronic Hardware That Survives Its Mission

Thermal Resistance and Steady-State Heat Flow in Electronics Thermal Design and Component Placement for Cooling Bathtub Curve of Infant Mortality, Useful Life and Wear-Out Coffin-Manson Model for Thermal Cycling Fatigue Qualification Testing Versus Production Screening Standby Redundancy and Switchover Reliability Exponential Decay Common-Cause Failure Limits on Redundancy Worst-Case Circuit Analysis Over Tolerance and Temperature Test-Analyze-and-Fix Reliability Growth Acceleration Factors in Accelerated Life Testing FMEA and FMECA for Electronic Assemblies Solder Joint Fatigue in Surface-Mount Assemblies Electrochemical Migration and Corrosion on Circuit Boards Physics of Failure Versus Handbook Reliability Prediction Hazard Rate and Proportional Hazard Rate Models Failure Definition and Failure Criteria in Reliability Engineering Spares Provisioning and Operational Availability ESD and Electrical Overstress Damage in Electronics Distinguishing MTBF from Useful Life in Reliability Claims Ohm's Law Multiplying Probabilities of Independent Events in Probability Tin Whisker Growth on Lead-Free Surface Finishes HALT to Find Operating and Destruct Limits Probability Density Function Arrhenius Equation MIL-HDBK-217 Parts Count Failure Rate Prediction Duane Model for Reliability Growth Tracking Parts and Materials Selection Control in Electronics Derating Electronic Components Below Rated Limits Censored and Suspended Units in Life Test Data HASS as a Production Screen Derived from HALT Incoming Inspection and Rescreening of Semiconductor Lots Closed-Loop Failure Reporting and Corrective Action k-of-n Voting Redundancy in Fault-Tolerant Electronics Environmental Stress Screening with Thermal Cycling and Random Vibration Stress-Strength Reliability in Statistics Transition from Development to Production Risk Templates Electromigration in Integrated Circuit Interconnects Series System Reliability as a Product of Block Reliabilities Time-Dependent Dielectric Breakdown in Gate Oxides Design Reference Mission Profile as a Reliability Requirement Junction Temperature Limits in Semiconductor Design Active Parallel Redundancy in Electronic Systems Weibull Distribution and the Shape Parameter β Constant Failure Rate λ and the Exponential Life Model Fault Tree Analysis and Minimal Cut Sets MTBF and MTTF as the Reciprocal of Failure Rate Build-to-Print Workmanship Control in Electronics Manufacturing Reliability Block Diagrams for System Modelling Root Cause Failure Analysis of Returned Electronics Survival Function Definition in Statistics FIT Units and Failures per 10^9 Component Hours Availability from MTBF and Mean Time to Repair Burn-In to Precipitate Infant Mortality Failures Weibull Probability Plotting and Median Rank Regression